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Properties of Molybdenum Sputtering Target

In order to increase sputtering efficiency and ensure film deposition quality, properties of Molybdenum sputtering target are required in a high standard.

Purity of Molybdenum sputtering target

High purity is fundamental requirement of molybdenum sputtering target. The higher purity molybdenum sputtering target is, the better performance molybdenum sputtering film deposition. Generally speaking, the purity of molybdenum sputtering target should reach 99.95% at least. With the development of LCD and electronic industry, purity of molybdenum sputtering target will be 99.99%--99.999%, or even higher.

Consistency
During sputtering coating, when Molybdenum sputtering target with low density is hitted, gas in gaps of target would be released. Thus, quality of molybdenum sputtering target is lowered. So, to molybdenum sputtering target, density is required above 98% to better performance target sputtering film deposition. Durante pulverización catódica recubrimiento, cuando se hitted molibdeno pulverización catódica objetivo con baja densidad, el gas en las lagunas de destino serían liberados. Por lo tanto, la calidad de blanco de pulverización catódica de molibdeno se reduce. Así que, para molibdeno objetivo de pulverización catódica, la densidad se requiere por encima de 98% a una mejor meta de desempeño deposición de película de pulverización catódica.
Die size and distribution

In general, Molybdenum sputtering target is polycrystalline structure. Size of die is measured from micrometer to millimeter. The smaller size the die is, the higher speed sputtering. And its distribution is balanced.

Bonding of target material and chassis

Molybdenum sputtering target is bonded with copper or Al etc. to ensure good conductivity of electricity and heat.

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