Molybdenum Plate Sputtering Target

Molybdenum Plate Sputtering Target


The thickness of molybdenum plate sputtering target is from 0.09 inch to 3 inch.Silver gray with metal luster. The melting point of molybdenum plate sputtering target is 2610℃ and boiling point is 5560 ℃,density is 10.2g/cm3.

Production processes

Molybdenum powder (raw-material)-pressing—sintering-inspecting-hot rolling-levelling and annealing-alkali washing-proceeding-packing-deliver


Molybdenum plate sputtering target was widely used in mould and furnace parts building, electron industry and semiconductor industry's components production, vacuum furnace, heating furnace and thermal insulation material's plate electrode and other fields.

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